1.

Conference Proceedings

Conference Proceedings
Baine, P.T. ; Quinn, L.J. ; Lee, B. ; Mitchell, S.J.N. ; Gamble, H.S. ; Armstrong, B.M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.214-221,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings

Conference Proceedings
Gay, D.L. ; Baine, P.T. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.536-543,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings

Conference Proceedings
Gay, D.L. ; Tweedie, M. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.307-312,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
4.

Conference Proceedings

Conference Proceedings
Li, X. ; Gay, D.L. ; McNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.313-320,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
5.

Conference Proceedings

Conference Proceedings
Bailey, P.T ; Jin, G. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.252-266,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
6.

Conference Proceedings

Conference Proceedings
Goh, W.L. ; Campbell, D.L. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.553-560,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7