Effect of Process Temperature and Reaction Cycle Number on Atomic Layer Deposition of TiO2 Thin Films Using TiCl4 and H2O Precursors: Correlation Between Material Properties and Process Environment

Effect of Process Temperature and Reaction Cycle Number on Atomic Layer Deposition of TiO₂ Thin Films Using TiCl₄ and H₂O Precursors: Correlation Between Material Properties and Process Environment

Author(s):

W. Chiappim

Publication title:

Brazilian journal of physics

Pub. Year:

2016

Vol.:

46

Issue:

1

Page(from):

56

Page(to):

69

Pages:

14

Pub. info.:

São Paulo, Brazil: Sociedade Brasileira de Física

ISSN:

01039733

Language:

English

Type:

Academic Journal

Details

TDL ID:

ZA00066274

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