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Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules

Author(s):
Satishchandra C. Wani  
Publication title:
2015 SAE world congress : technical paper
Title of ser.:
Society of Automotive Engineers technical paper series
Ser. no.:
2015
Pub. Year:
2015
No.:
2015-01-0195
Paper no.:
2015-01-0195
Pages:
5
Pub. info.:
Warrendale, Penn.: Society of Automotive Engineers
ISSN:
01487191
Language:
English
Call no.:
S10400
Type:
Technical Paper

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