New MEMS Process Technology for Pressure Sensors Integrated with CMOS Circuits

New MEMS Process Technology for Pressure Sensors Integrated with CMOS Circuits

Author(s):

Publication title:

2014 SAE world congress : technical paper

Title of ser.:

Society of Automotive Engineers technical paper series

Ser. no.:

2014

Pub. Year:

2014

No.:

2014-01-0321

Paper no.:

2014-01-0321

Pages:

5

Pub. info.:

Warrendale, Penn.: Society of Automotive Engineers

ISSN:

01487191

Language:

English

Call no.:

S10400

Type:

Technical Paper

Details

TDL ID:	ZA00053491
Series ID:	PA00000058
Conf. info. (Name):	SAE World Congress & Exhibition
Conf. info. (Number):	2014
Conf. info. (Venue):	Detroit, Michigan, USA
Conf. info. (Date):	2014.04.08-2014.04.10
Note for article:	SAE 2014 World Congress & Exhibition, Detroit, Michigan, USA, April 8-10, 2014. Technical Paper

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