Blank Cover Image

Implementation of Automobile Cockpit Module Assembly System Using the Augmented Reality Technology.

Author(s):
Publication title:
S.M.E. technical paper
Title of ser.:
SME Technical Paper : TP
Ser. no.:
2008
Pub. Year:
2008
No.:
TP08PUB103
Paper no.:
TP08PUB103
Pages:
8
Pub. info.:
Dearborn, Mich.: Society of Manufacturing Engineers
Language:
English
Call no.:
S42600
Type:
Technical Paper

Similar Items:

Hong, Y., Park, H.-W., Yu, S.-J., Hong, D.-P., Choi, H.-K

Society of Automotive Engineers

Park, K-H., Bae, M-S., Yoo, D-H., Shankar, S., Kim, B-H.

Society of Automotive Engineers

Post,J.W., Law,E.H.

Society of Automotive Engineering, Inc.

Choi, W., Park, H., Lee, S.

Society of Automotive Engineers

Choi, K. H., Park, J. H., Lee, N. H., Yu, C. H., Noh, S. H.

Society of Automotive Engineers

Yu,K.-W., Uhm,M.-S., Chang,D.-P., Kang,S.-C., Lee,J.-H.

American Institute of Aeronautics and Astronautics

Post,J.W., Law,E.H.

Society of Automotive Engineering, Inc.

Park, T.-J., Oh, S.-W., Jang, J.-H., Han, C.-S.

Society of Automotive Engineers

Jo, J., Park, J., Lee, S., Jeong, Y., Choi, W.

American Institute of Aeronautics and Astronautics

Choi,W.-S., Park,G.-J., Park,K.-B.

American Institute of Aeronautics and Astronautics

Choi,K.H., Park,J.H., Lee,N.H., Yu,C.H., Noh,S.H.

Society of Automotive Engineers

Choi, W., Choi, B-C., Park, H-K., Joo, K-J., Lee, J-H.

Society of Automotive Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12