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Thermal and Mass Modeling of the Laser- Point Sealing Process in MEMS Packaging.

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : HT-FED
Ser. no.:
2004
Pub. Year:
2004
No.:
HT-FED04-56116
Paper no.:
HT-FED04-56116
Pages:
7
Pub. info.:
New York, NY: American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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