New instrumentation technologies for testing the bonding of sensors to solid materials

New instrumentation technologies for testing the bonding of sensors to solid materials

Author(s):

Hashemian, H. M. ( Analysis and Measurement Services Corp. )
Shell, C. S. ( Analysis and Measurement Services Corp. )
Jones, C. N. ( Analysis and Measurement Services Corp. )

Publication title:

NASA Technical Reports

Pub. Year:

1996

Vol.:

19960027980

Issue:

NASA-CR-4744

Pt.:

NAS 1.26:4744

Paper no.:

N96-29107

Page(from):

1

Page(to):

412

Pages:

412

Pub. info.:

National Aeronautics and Space Adminstration

Language:

English

Type:

Technical Paper

Details

TDL ID:

ZA00001432

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