Inelastic strain analysis of solder joint in NASA fatigue specimen
- Author(s):
- Dasgupta, Abhijit ( Maryland Univ. )
- Oyan, Chen ( Maryland Univ. )
- Publication title:
- NASA Technical Reports
- Pub. Year:
- 1991
- Issue:
- NASA-CR-187864
- Pt.:
- NAS 1.26:187864
- Paper no.:
- N91-16132
- Page(from):
- 1
- Page(to):
- 60
- Pages:
- 60
- Pub. info.:
- National Aeronautics and Space Adminstration
- Language:
- English
- Type:
- Technical Paper
Similar Items:
|
National Aeronautics and Space Adminstration |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
8
Technical Paper
A nonlinear multi-domain themomechanical stress analysis method for surface-mount solder joints: Part II: Viscoplastic analysis
The American Society of Mechanical Engineers |
|
3
Technical Paper
Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
4
Technical Paper
Fatigue life of misregistered J-lead solder joints through an energy-partitioning analysis
The American Society of Mechanical Engineers |
10
Technical Paper
A nested finite element methodology (NFEM) for stress analysis of flip chip on board assemblies - part II: Viscoplastic analysis
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
12
Technical Paper
Fatigue Analysis of Swept Friction Stir Clinch Joints between Aluminum and Steel Sheets
Society of Automotive Engineers |