Tensile Creep of SiC Whisker Reinforced Silicon Nitride

Tensile Creep of SiC Whisker Reinforced Silicon Nitride

Author(s):

Hockey,B.J. ( National Institute of Standards and Technology )
Wiederhorn,S.M. ( GTE Laboratories, Inc. )
Liu,W.
Baldoni,J.G.
Buljan,S.-T.

Publication title:

Proceedings of Twenty-seventh Automotive Technology Development Contractors' Coordination Meeting

Title of ser.:

SAE publication

Ser. no.:

P-230

Pub. Year:

1990

Page(from):

251

Page(to):

264

Pages:

14

Pub. info.:

Warrendale, Pa.: Society of Automotive Engineering

ISBN:

9781560910411 [1560910410]

Language:

English

Call no.:

S10300/P-230

Type:

Technical Paper

Details

TDL ID:	ZA00000217
Series ID:	PA00000002
Conf. info. (Name):	Annual Automotive Technology Development Contractors' Coordination Meeting
Conf. info. (Number):	27th
Conf. info. (Venue):	Dearborn, MI, USA
Conf. info. (Date):	1989.10.23-1989.10.26

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