A nonlinear multi-domain stress analysis method for surface-mount solder joints
- Author(s):
- Ling, S. ( University of Maryland )
- Dasgupta, A.
- Publication title:
- A.S.M.E. paper
- Title of ser.:
- ASME Technical Paper : WA/EEP
- Ser. no.:
- 1995
- Pub. Year:
- 1995
- No.:
- 95-WA/EEP-7
- Paper no.:
- 95-WA/EEP-7
- Pub. info.:
- New York: The American Society of Mechanical Engineers
- Language:
- English
- Call no.:
- A11800
- Type:
- Technical Paper
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