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An incremental damage superposition approach for reliability of electronic interconnects under combined accelerated stresses

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1997
Pub. Year:
1997
No.:
97-WA/EEP-13
Paper no.:
97-WA/EEP-13
Pub. info.:
New York: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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