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Effect of underfill in flip chip on board assemblies

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1998
Pub. Year:
1998
No.:
98-WA/EEP-15
Paper no.:
98-WA/EEP-15
Pub. info.:
New York: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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