Low stress aerobic urethanes lower costs for microelectronic encapsulation

Low stress aerobic urethanes lower costs for microelectronic encapsulation

Author(s):

Arnold, John R. ( Dymax Corporation )
Forman, Samuel F.

Publication title:

SME technical paper series

Pub. Year:

1995

No.:

EE95-263

Paper no.:

EE95-263

Page(from):

1P

Pub. info.:

Society of Manufacturing Engineers

ISSN:

01616382

Language:

English

Type:

Technical Paper

Details

TDL ID:	ZA00009069
Note for article:	ADHESIVES '95 September 19-21, 1995 Chicago, Illinois

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