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A two-level micro/macro approach to the simulation of air flow and heat transfer in typical convection-cooled electronic systems

Author(s):
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1991
Pub. Year:
1991
No.:
91-WA-EEP-33
Paper no.:
91-WA-EEP-33
Page(from):
1P
Pub. info.:
New York, NY: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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