Thermomechanical durability analysis of flip chip solder interconnects without underfill

Thermomechanical durability analysis of flip chip solder interconnects without underfill

Author(s):

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : WA/EEP

Ser. no.:

1997

Pub. Year:

1997

No.:

97-WA/EEP-11

Paper no.:

97-WA/EEP-11

Pub. info.:

New York: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002523
Series ID:	PA00000200
Conf. info. (Name):	ASME International Mechanical Engineering Congress & Exposition
Conf. info. (Number):	1997
Conf. info. (Venue):	Dallas, Texas
Conf. info. (Date):	1997.11.16-1997.11.21
Note for article:	Presented at the ASME International Mechanical Engineering Congress & Exposition Dallas, Texas - November 16-21, 1997

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