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Thermal fatigue life prediction of encapsulated flip chip solder joints for surface laminar circuit packaging

Author(s):
Lau, John H. ( Hewlett-Packard Company )  
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1992
Pub. Year:
1992
No.:
92-WA/EEP-34
Paper no.:
92-WA/EEP-34
Pub. info.:
New York, NY: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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