Thermal fatigue life of the VSPATM package solder joints

Thermal fatigue life of the VSPATM package solder joints

Author(s):

Murphy, R. Sean ( Georgia Institute of Technology )
Sitaraman, Suresh K.
Bartoszek, John

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : WA/EEP

Ser. no.:

1996

Pub. Year:

1996

No.:

96-WA/EEP-13

Paper no.:

96-WA/EEP-13

Pub. info.:

New York: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002543
Series ID:	PA00000200
Conf. info. (Name):	ASME International Mechanical Engineering Congress & Exhibition
Conf. info. (Number):	1996
Conf. info. (Venue):	Atalanta, Ga.
Conf. info. (Date):	1996.11.17-1996.11.22
Note for article:	Presented at the 1996 ASME International Mechanical Engineering Congress & Exhibition Atalanta, Ga. - November 17-22, 1996

Similar Items:

1 Technical Paper Fracture-mechanics-based delamination growth prediction in the VSPATM package-testing and characterization Sundararaman, Viswanathan, Sitaraman, Suresh K. The American Society of Mechanical Engineers	7 Technical Paper PBGA solder joint thermal fatigue life evaluation Wong, T. E., Cohen, H. M., Chu, D. W. The American Society of Mechanical Engineers
2 Technical Paper Fracture-mechanics-based delamination growth prediction in the VSPATM package-numerical simulation Harries, Richard J., Sitaraman, Suresh K. The American Society of Mechanical Engineers	8 Technical Paper Thermal fatigue damage in the solder joints of leadless chip resistors Govila, R. K., Jih, E., Pao, Y.-H., Larner, C. The American Society of Mechanical Engineers
3 Technical Paper Thermal fatigue life prediction of encapsulated flip chip solder joints for surface laminar circuit packaging Lau, John H. The American Society of Mechanical Engineers	9 Technical Paper J-lead solder joint thermal fatigue life model Wong, T.E., Kachatorian, L.A., Cohen, H.M. The American Society of Mechanical Engineers
4 Technical Paper A damage accumulation model for thermal cycle fatigue life prediction of solder joints Syed, Ahmer R. The American Society of Mechanical Engineers	10 Technical Paper CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method. Wong, T. E., Lau, C. Y., Fenger, H. S. American Society of Mechanical Engineers
5 Technical Paper Corrosion of Lead-Tin and Lead-Free Solders in Engine Coolants Amold,John R., Murphy,Sean Society of Automotive Engineering, Inc.	11 Technical Paper A systems approach to solder joint fatigue in spacecraft electronic packaging Ross, R. G., Jr. The American Society of Mechanical Engineers
6 Technical Paper Modeling solder joint fatigue life for gullwing leaded packages: Part 1 - Elastic plastic stress model Gupta, Vineet K., Barker, Donald B. The American Society of Mechanical Engineers	12 Technical Paper Experimental and analytical studies of 28-pin thin small outline package (TSOP) solder-joint reliability Lau, John, Golwalkar, Suresh, Rice, Don, Erasmus, Steve, Surratt, Robert, Boysan, Paul The American Society of Mechanical Engineers

1

2

3

4

5

6

7

8

9

10

11

12