Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life

Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life

Author(s):

Barker, Donald B. ( University of Maryland )
Sharif, Irfan
Dasgupta, Abhijit
Pecht, M. G.

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : WA/EEP

Ser. no.:

1991

Pub. Year:

1991

No.:

91-WA-EEP-25

Paper no.:

91-WA-EEP-25

Pub. info.:

New York, NY: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002733
Series ID:	PA00000200
Conf. info. (Name):	ASME Winter Annual Meeting
Conf. info. (Number):	1991
Conf. info. (Venue):	Atlanta, GA
Conf. info. (Date):	1991.12.01-1991.12.06
Note for article:	Presented at the ASME Winter Annual Meeting December 1-6, 1991 Atlanta, GA

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