Effect of bending on chip scale package interconnects

Effect of bending on chip scale package interconnects

Author(s):

Publication title:

A.S.M.E. paper

Title of ser.:

ASME Technical Paper : IMECE/EEP

Ser. no.:

1999

Pub. Year:

1999

No.:

99-IMECE/EEP-7

Paper no.:

99-IMECE/EEP-7

Pub. info.:

New York: The American Society of Mechanical Engineers

Language:

English

Call no.:

A11800

Type:

Technical Paper

Details

TDL ID:	ZA00002259
Series ID:	PA00000236
Conf. info. (Name):	ASME International Mechanical Engineering Congress & Exposition
Conf. info. (Number):	1999
Conf. info. (Venue):	Nashville, Tennessee
Conf. info. (Date):	1999.11.14-1999.11.19
Note for article:	Presented at the ASME International Mechanical Engineering Congress & Exposition Nashville - Tennessee, November 14-19,

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