Blank Cover Image

A damage accumulation model for thermal cycle fatigue life prediction of solder joints

Author(s):
Syed, Ahmer R. ( Delco Electronics Corporation )  
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1994
Pub. Year:
1994
No.:
94-WA/EEP-10
Paper no.:
94-WA/EEP-10
Pub. info.:
New York: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

Similar Items:

Wong, T.E., Suastegui, I., Cohen, H.M., Matsunaga, A.H.

The American Society of Mechanical Engineers

Wong, T. E., Cohen, H. M., Chu, D. W.

The American Society of Mechanical Engineers

Murphy, R. Sean, Sitaraman, Suresh K., Bartoszek, John

The American Society of Mechanical Engineers

Wong, T. E., Lau, C. Y., Fenger, H. S.

American Society of Mechanical Engineers

Syed,Ahmer R.

SPIE-The International Society for Optical Engineering

Wong, T.E., Kachatorian, L.A., Cohen, H.M.

The American Society of Mechanical Engineers

Liu, D. Ron, Jairazbhoy, V. A.

The American Society of Mechanical Engineers

Govila, R. K., Jih, E., Pao, Y.-H., Larner, C.

The American Society of Mechanical Engineers

Fields, S., Liguore, S., Followell, D., Perez, R.

The American Society of Mechanical Engineers

Lau, John H.

The American Society of Mechanical Engineers

A.C. de Brito, M.L. de Oliveira e Souza

Society of Automotive Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12