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Solder joint reliability of surface mount connectors

Author(s):
Lau, J. ( Hewlett-Packard Company )
Marcotte, T.
Severine, J.
Lee, A.
Erasmus, S.
Baker, T.
Moldaschel, J.
Sporer, M.
Burward-Hoy, G.
4 more
Publication title:
A.S.M.E. paper
Title of ser.:
ASME Technical Paper : WA/EEP
Ser. no.:
1992
Pub. Year:
1992
No.:
92-WA/EEP-39
Paper no.:
92-WA/EEP-39
Pub. info.:
New York, NY: The American Society of Mechanical Engineers
Language:
English
Call no.:
A11800
Type:
Technical Paper

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