Microstructure and Mechanical Properties of Equiatomic CrMnCoNiCu High Entropy Alloy

Microstructure and Mechanical Properties of Equiatomic CrMnCoNiCu High Entropy Alloy

Author(s):

Publication title:

5th Asia Conference on Mechanical and Materials Engineering

Title of ser.:

Materials science forum

Ser. no.:

909

Pub. Year:

2017

Page(from):

39

Page(to):

43

Pages:

5

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035712919 [3035712913]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00066581
Series ID:	PA00000012
Conf. info. (Name):	Asia Conference on Mechanical and Materials Engineering (ACMME 2017)
Conf. info. (Number):	5th
Conf. info. (Venue):	Tokyo, Japan
Conf. info. (Date):	2017.06.09-2017.06.11
Note for article:	5th Asia Conference on Mechanical and Materials Engineering (ACMME 2017), June 9-11, 2017, Tokyo, Japan

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