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Effect of Bonding Temperature on Microstructure Development during Transient Liquid Phase Bonding of Ti2AlNb Alloy Using Ti-Zr-Cu Based Filler Alloy

Author(s):
Publication title:
IUMRS International Conference in Asia
Title of ser.:
Materials science forum
Ser. no.:
898
Pub. date:
2017
Pt.:
2
Page(from):
1247
Page(to):
1253
Pages:
7
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783035711516 [3035711518]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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