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Numerical Simulation on Filling Process of SiCp/A357 Composites

Author(s):
Publication title:
IUMRS International Conference in Asia
Title of ser.:
Materials science forum
Ser. no.:
898
Pub. Year:
2017
Pt.:
1
Page(from):
859
Page(to):
864
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783035711516 [3035711518]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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