Effects of Nano Copper Additive on Thermal Conductivity of Magnetorheological Fluid at Different Environment Temperature

Effects of Nano Copper Additive on Thermal Conductivity of Magnetorheological Fluid at Different Environment Temperature

Author(s):

Publication title:

Material Science and Engineering Technology V

Title of ser.:

Materials science forum

Ser. no.:

890

Pub. Year:

2017

Page(from):

108

Page(to):

111

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035710281 [3035710287]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00066562
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Material Science and Engineering Technology
Conf. info. (Number):	5th
Conf. info. (Venue):	Tokyo, Japan
Conf. info. (Date):	2016.10.29-2016.10.31
Note for article:	5th International Conference on Material Science and Engineering Technology, October 29-31, 2016, University of Tokyo, Japan

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