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Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on- Glass Packaging Using Anisotropic Conductive Film Bonding

Author(s):
Publication title:
Nano Engineering and Materials Technologies
Title of ser.:
Materials science forum
Ser. no.:
886
Pub. Year:
2017
Page(from):
97
Page(to):
101
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783035711042 [3035711046]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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