An Experiment on the Bond-Slip Behaviors of Pre-Tensioned Prestressed UHPC Members

An Experiment on the Bond-Slip Behaviors of Pre-Tensioned Prestressed UHPC Members

Author(s):

Publication title:

Advanced Materials Design and Mechanics IV

Title of ser.:

Materials science forum

Ser. no.:

878

Pub. Year:

2017

Page(from):

161

Page(to):

164

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035710601 [3035710600]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00066550
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Advanced Materials Design and Mechanics (ICAMDM2016)
Conf. info. (Number):	4th
Conf. info. (Venue):	Jeju Island, South Korea
Conf. info. (Date):	2016.08.20-2016.08.21
Note for article:	4th International Conference on Advanced Materials Design and Mechanics (ICAMDM2016), August 20-21, 2016, Jeju Island, South Korea

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