Blank Cover Image

Evalution of Flip Chip Interconnects Using Acoustic Microscopy for Failure Analysis and Process Control Applications

Author(s):
Publication title:
1995 International Conference on Multichip Modules : proceedings : 19-21 April 1995, Denver, Colorado
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2575
Pub. Year:
1995
Page(from):
279
Page(to):
285
Pages:
7
Pub. info.:
Bellingham, WA: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780930815424 [0930815424]
Language:
English
Call no.:
P63600/2575
Type:
Conference Proceedings

Similar Items:

Martell,S.R., Semmens,J.E., Kessler,L.W.

SPIE-The International Society for Optical Engineering

Berlin, C.W., Sarma, D.H.R., Sozansky, W.A., Zimmerman, D.W.

IMAPS

Harsanyi,Gabor, Percsi,L., Semmens,J.E., Martell,S.R., Toth,E.

SPIE - The International Society for Optical Engineering, IMAPS

Shang, S.D., Granik, Y., Cobb, N.B., Maurer, W., Cui, Y., Liebmann, L.W., Oberschmidt, J.M., Singh, R.N., Vampatella, …

SPIE-The International Society for Optical Engineering

Clapp, T.V., Cahill, L.W.

SPIE-The International Society for Optical Engineering

Shang, S.D., Granik, Y., Cobb, N.B., Maurer, W., Cui, Y., Liebmann, L.W., Oberschmidt, J.M., Singh, R.N., Vampatella, …

SPIE-The International Society for Optical Engineering

Cahill, L.W.

SPIE - The International Society of Optical Engineering

Zou, B., Kober, M., Blum, F., Mieslinger, S., Gaherty, L., Steinberg, W., Bahn, B., Wernle, M., Neahaus, H.

IMAPS

Jong, W.R., Chen, S.C., Lai, C.C., Kuo, T.H., Liu, H.W., Ho, S., Lo, W.Y.

Society of Plastics Engineers

Rocsch,Michael, Teichner,Robert W., Martens,Rod

IMAPS

Soper, A., Wolf, I. De, Pozza, G., Ignat, M., Parat, G.

MRS - Materials Research Society

Shacklette,L.W., Norwood,R.A., Eldada,L.A., Glass,C., Nguyen,D., Poga,C., Xu,B., Yin,S., Yardley,J.T.

SPIE-The International Society for Optical Engineering

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12