Cost-effective optoelectronic packaging for multichip modules and backplane level optical interconnects
- Author(s):
- Publication title:
- Optoelectronic interconnects III : 8-9 February 1995, San Jose, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2400
- Pub. Year:
- 1995
- Page(from):
- 61
- Page(to):
- 73
- Pages:
- 13
- Pub. info.:
- Bellingham, WA: Society of Photo-optical Instrumentation Engineers
- ISSN:
- 0277786X
- ISBN:
- 9780819417473 [0819417475]
- Language:
- English
- Call no.:
- P63600/2400
- Type:
- Conference Proceedings
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