TDR-like low-frequency circuit test and characterization system for package and module interconnects utilizing transient thermal signals

TDR-like low-frequency circuit test and characterization system for package and module interconnects utilizing transient thermal signals

Author(s):

Publication title:

Optical characterization techniques for high-performance microelectronic device manufacturing : 20 October 1994, Austin, Texas

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2337

Pub. Year:

1994

Page(from):

38

Page(to):

46

Pages:

9

Pub. info.:

Bellingham, WA: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819416704 [0819416703]

Language:

English

Call no.:

P63600/2337

Type:

Conference Proceedings

Details

TDL ID:	ZA00057540
Series ID:	PA00000029
Conf. info. (Name):	Symposium on optical characterization techniques for high-performance microelectronic device manufacturing
Conf. info. (Number):	1994
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1994.10.20
Note for article:	1994 Symposium on optical characterization techniques for high-performance microelectronic device manufacturing, October 20, 1994, Austin, TX, USA. 2337-06

Similar Items:

1 Conference Proceedings Characterization of Microstrip Interconnects by Transient Thermal Pulses Pitner,Gregory, Flake,Robert H., Wong,Anthony SPIE-The International Society for Optical Engineering	7 Conference Proceedings Optical profilometer featuring multiple virtual styli for the packaging and interconnect environment R. Clark, R.H. Flake, A. Siddique Society of Photo-optical Instrumentation Engineers
2 Conference Proceedings Package and module substrate interconnect evaluation by thermal time domain reflectometry(TTDR) Shon,S., Flake,R.H., Wong,A. SPIE-The International Society for Optical Engineering	8 Conference Proceedings Hardware and methods of the optical end-to-end test of the Far-Ultraviolet Spectroscopic Explorer(FUSE) Conard,S.J., Redman,K.W., Barkhouser,R.H., McGuffey,D.B., Smee,S., Ohl,R.G., Kushner,G.D. SPIE - The International Society for Optical Engineering
3 Conference Proceedings High-Frequency Characterization of Interconnects for Phased Array Packages Linda P.B. Katehi Society of Photo-optical Instrumentation Engineers	9 Conference Proceedings Thermal shift in the exciton absorption maxima as a function of the chip package design Buchholz,D.B., Lentine,A.L., Novotny,R.A. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Printing systems for MEMS packaging Hayes,D.J., Cox,W.R., Wallace,D.B. SPIE-The International Society for Optical Engineering	10 Technical Paper A PC-Based Fuel and Ignition Control System Used to Map the 3-D Surfaces of Torque and Emissions Versus Air-Fuel Ratio and Ignition Timing Franklin,M.L., Kittelson,D.B., Leuer,R.H., Pipho,M.J. Society of Automotive Engineering, Inc.
5 Technical Paper DESIGN, DEVELOPMENT AND TEST OF SHUTTLE/CENTAUR G-PRIME CRYOGENIC TANKAGE THERMAL PROTECTION SYSTEMS Knoll, R.H. National Aeronautics and Space Administration	11 Conference Proceedings A Step Forward in the Transient Thermal Characterization of Packages Szekely,V., Rencz,Matta., Courrois,B. IMAPS
6 Conference Proceedings VCSEL-based modules for optical interconnects Strzelecka,E.M., Morgan,R.A., Liu,Y., Walterson,B., Skogen,J., Kalweit,E., Bounak,S., Chanhvongsak,H., Marta,T., … SPIE - The International Society for Optical Engineering	12 Conference Proceedings Longitudinal hollow cathode copper ion laser: optimization of excitation and geometry Mihailova, D.B., Grozeva, M.G., Bogaerts, A., Gijbels, R.H., Sabotinov, N.V. SPIE - The International Society of Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12