Tengyan Zhang, L. T. Fan, Jiahong Liu, John R. Schlup, Paul A. Seib Seib
American Institute of Chemical Engineers
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Tengyan Zhang, L.T. Fan
American Institute of Chemical Engineers
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L.T. Fan, Tengyan Zhang, Jiahong Liu, John R. Schlup, Ferenc Friedler
American Institute of Chemical Engineers
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Tengyan Zhang, L.T. Fan
American Institute of Chemical Engineers
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L.T. Fan, Tengyan Zhang, Jiahong Liu, Paul A. Seib, S.T. Chou
American Institute of Chemical Engineers
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L.T. Fan, Tengyan Zhang
American Institute of Chemical Engineers
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L.T. Fan, Tengyan Zhang, Jiahong Liu, Paul A. Seib, S.T. Chou
American Institute of Chemical Engineers
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L.T. Fan, Tengyan Zhang
American Institute of Chemical Engineers
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L. T. Fan, Tengyan Zhang, Jiahong Liu, Paul A. Seib Seib, Ferenc Friedler
American Institute of Chemical Engineers
|
L.T. Fan, Tengyan Zhang
American Institute of Chemical Engineers
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Tengyan Zhang, L.T. Fan, John R. Schlup
American Institute of Chemical Engineers
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Jiahong Liu, L.T. Fan, Paul A. Seib, Ferenc Friedler, Botond Bertok
American Institute of Chemical Engineers
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