Tribological, Thermal and Kinetic Attributes of Copper and Silicon Dioxide CMP Processes

Tribological, Thermal and Kinetic Attributes of Copper and Silicon Dioxide CMP Processes

Author(s):

Publication title:

2004 AIChE annual meeting, Austin Covention Center, Austin, Texas, November 7-12 : conference proceedings

Title of ser.:

AIChE Conference Proceedings

Ser. no.:

P-213

Pub. Year:

2004

Page(from):

91c

Pages:

8

Pub. info.:

New York: American Institute of Chemical Engineers

ISBN:

9780816909650 [0816909652]

Language:

English

Call no.:

A08000/2004 [CD-ROM]

Type:

Conference Proceedings

Details

TDL ID:	ZA00061157
Series ID:	PA00000008
Conf. info. (Name):	AIChE Annual Meeting
Conf. info. (Number):	2004
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	2004.11.07-2004.11.12
Note for article:	AIChE Annual Meeting, November 7-12, 2004, Austin, Texas

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