Blank Cover Image

Numerical and Experimental Study of Temperature Rise Effect on Copper during Equal Channel Angular Pressing

Author(s):
Publication title:
Methods of Design and Characterization of Materials, Research and Development of Technological Processes : selected, peer reviewed papers from the Chinese Materials Conference 2015, July 10-14, 2015, Guiyang, China
Title of ser.:
Materials science forum
Ser. no.:
850
Pub. Year:
2016
Page(from):
864
Page(to):
872
Pages:
9
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783038357629 [3038357626]
Language:
English
Call no.:
M23650 [v.850]
Type:
Conference Proceedings

Similar Items:

T.B. Guo, Q. Li, C. Wang, S.R. Wei, Y.B. Wu

Trans Tech Publications

Pushin, V.G., Valiev, R.Z., Zhu, Y.T., Prokoshkin, S.D., Gunderov, D.V., Yurchenko, L.I.

Trans Tech Publications

T.B. Guo, J.Y. Zhao, Y.T. Ding

Trans Tech Publications

C.F. Gu, L.S. Tóth, B. Beausir, T. Williams, C.H.J. Davies

Trans Tech Publications

J.X. Huang, J.T. Wang

Trans Tech Publications

Miyamoto, H., Fushimi, J., Mimaki, T., Vinogradov, A., Hashimoto, S.

Trans Tech Publications

H.L. Jia, K. Marthinsen, Y.J. Li

Trans Tech Publications

F. Liu, J.T. Wang, Z.N. Mao, C.P. Zhou, Y. Jiang

Trans Tech Publications

H.L. Jia, K. Marthinsen, Y.J. Li

Trans Tech Publications

F. Liu, Y. Liu, J.T. Wang

Trans Tech Publications

M. Furukawa, Z. Horita, T.G. Langdon

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12