A New Lead-Free Solder Joint Utilizing Superplastic Al-Zn Eutectoid Alloy for Next Generation SiC Power Semiconductor Devices

A New Lead-Free Solder Joint Utilizing Superplastic Al-Zn Eutectoid Alloy for Next Generation SiC Power Semiconductor Devices

Author(s):

Publication title:

Superplasticity in Advanced Materials - ICSAM 2015 : Selected, peer reviewed papers from the 12th International Conference on Superplasticity in Advanced Materials (ICSAM 2015), September 7-11, 2015, Tokyo, Japan

Title of ser.:

Materials science forum

Ser. no.:

838-839

Pub. Year:

2016

Page(from):

482

Page(to):

487

Pages:

6

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783038356721 [3038356727]

Language:

English

Call no.:

M23650 [v.838-839]

Type:

Conference Proceedings

Details

TDL ID:	ZA00054296
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Superplasticity in Advanced Materials (ICSAM 2015)
Conf. info. (Number):	12th
Conf. info. (Venue):	Tokyo, Japan
Conf. info. (Date):	2015.09.07-2015.09.11
Note for article:	12th International Conference on Superplasticity in Advanced Materials (ICSAM 2015), September 7-11, 2015, Tokyo, Japan

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