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Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Author(s):
Publication title:
Advanced Materials and Manufacturing Processes for Strategic Sectors : Selected, peer reviewed papers from the International Conference on Advanced Materials and Manufacturing Processes for Strategic Sectors (ICAMPS 2015), May 13-15, 2015, Trivandrum, India
Title of ser.:
Materials science forum
Ser. no.:
830-831
Pub. Year:
2015
Page(from):
215
Page(to):
218
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783038355366 [3038355364]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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