Blank Cover Image

Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects

Author(s):
Publication title:
Advanced Functional Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China
Title of ser.:
Materials science forum
Ser. no.:
815
Pub. Year:
2015
Page(from):
22
Page(to):
29
Pages:
8
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Replacement of High-Purity Copper Target by High-Purity Copper Alloy Target in Very Large Scale Integrated Circuit

Y. Gao, X. Liu, J.J. He, H. Zeng, X.D. Xiong

Trans Tech Publications
7 Conference Proceedings A Research on Energy-Saving and Environmental Impacts of Primary Magnesium and Magnesium Alloy Production in China

F. Gao, Z.R. Nie, Z.H. Wang, X.Z. Gong, T.Y. Zuo

Trans Tech Publications
2 Conference Proceedings Copper Electroplating for Damascene ULSI Interconnects

Dubin, V. M., Lopatin, S., Chen, S., Cheung, R., Ryu, C., Wong, S. S.

MRS - Materials Research Society
8 Conference Proceedings Research on Grain Refinement Process and Microstructure of Ultra-High Purity Copper Used for Integrated Circuit

X. Zeng, J.J. He, X. Jiang, H. Zeng, X.Y. Wan

Trans Tech Publications
3 Conference Proceedings Application of Quenching and Partitioning to Improve Ductility of Ultrahigh Strength Low Alloy Steel

W.Q. Cao, C.Y. Wang, J. Shi, H. Dong

Trans Tech Publications
9 Conference Proceedings EFFECTS OF VACANCY CLUSTERING ON STABILIZATOIN OF MARTENSITE COPPER BASED SHAPE MEMORY ALLOYS

Kong, Yingjie, Jiang, Bohong, Hsu, T.Y., Wang, Baoyi, Wang, Tianming

Materials Research Society
4 Conference Proceedings A Pipeline Designed Reconfigurable CNC Architecture

J.C. Dong, T.Y. Wang

Trans Tech Publications
10 Conference Proceedings Deformation Behavior of FeMnSi-Based Shape-Memory Alloys

Guo, Z.H., Rong, Y.H., Chen, S.P., Hsu, T.Y.

Trans Tech Publications
5 Conference Proceedings Ultrahigh-speed processor using optical interconnects

Kim,J., Kostrzewski,A.A., Kim,D.H., Vasiliev,A.A., Savant,G.D., Jannson,T., Huang,S., Chen,J.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Ternary Sm-Al-Co Bulk Metallic Glass Formation Designed Using a Cluster Line Approach

J. Wu, Q. Wang, Y.H. Li, J.B. Qiang, Y.M. Wang, C. Dong

Trans Tech Publications
6 Conference Proceedings Copper ULSI Interconnect Technology

Edelstein, D.

MRS - Materials Research Society
12 Conference Proceedings Microtexture And Strain In Electroplated Copper Interconnects

Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., …

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12