Effects of Cu Contamination on the Electrical Properties of Multicrystalline Silicon Purified by Directional Solidification Route

Effects of Cu Contamination on the Electrical Properties of Multicrystalline Silicon Purified by Directional Solidification Route

Author(s):

Publication title:

2014 China Functional Materials Technology and Industry Forum : Selected, peer reviewed papers from the 2014 China Functional Material Technology and Industry Forum (CFMTIF 2014), August 26-28, 2014, Xi'an, China

Title of ser.:

Materials science forum

Ser. no.:

809-810

Pub. Year:

2015

Page(from):

846

Page(to):

854

Pages:

9

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054274
Series ID:	PA00000012
Conf. info. (Name):	China Functional Material Technology and Industry Forum (CFMTIF 2014)
Conf. info. (Number):	2014
Conf. info. (Venue):	Xi'an, China
Conf. info. (Date):	2014.08.26-2014.08.28
Note for article:	2014 China Functional Material Technology and Industry Forum (CFMTIF 2014), August 26-28, 2014, Xi'an, China

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