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Research on HfSiN Diffusion Barrier Thin Film for Micro-Nanoscale ULSI-Cu Metallization

Author(s):
Publication title:
2014 China Functional Materials Technology and Industry Forum : Selected, peer reviewed papers from the 2014 China Functional Material Technology and Industry Forum (CFMTIF 2014), August 26-28, 2014, Xi'an, China
Title of ser.:
Materials science forum
Ser. no.:
809-810
Pub. Year:
2015
Page(from):
583
Page(to):
588
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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