Blank Cover Image

Study on Grinding Force Model in Ultrasonic Vibration Assisted Grinding for Ductile Materials

Author(s):
Publication title:
Advances in materials manufacturing science and technology XV : selected, peer reviewed papers from the 15th International Manufacturing Conference in China (15th IMCC), October 16-18, 2013, Nanjing, China
Title of ser.:
Materials science forum
Ser. no.:
770
Pub. Year:
2014
Page(from):
207
Page(to):
212
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

X.Y. Cao, B. Lin, Y. Wang, S.L. Wang

Trans Tech Publications

G.F. Li, L.S. Wang, S.X. Yang

Trans Tech Publications

S.L. Wang, B. Lin, Y. Wang, X.Y. Cao

Trans Tech Publications

Chen, S., Wang, M., Huang, Y., Mao, X., Liu, H.

SPIE - The International Society of Optical Engineering

H.L. Zhang, J.H. Zhang, M.Y. Huo

Trans Tech Publications

X.H. Niu, X.Y. Liu, S.L. Wang, B.M. Tan

Trans Tech Publications

Wu, Y. B., Nomura, M., Feng, Z. J., Kato, M.

Trans Tech Publications

Y.Y. Yan, B. Zhao, Y. Wu, C.S. Liu, X.S. Zhu

Trans Tech Publications

S.L. Lü, P. Xiao, S.S. Wu, X.G. Fang

Trans Tech Publications

Wang, D. S., Zhou, A. P., Huang, P. L., Zhao, X. Y.

Trans Tech Publications

S.L. Lü, P. Xiao, S.S. Wu, X.G. Fang

Trans Tech Publications

S.S. Wu, C. Lin, S.L. Lü, P. An, L. Wan

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12