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Effect of Sn Content on the Microstructure, Mechanical and Electrical Properties of Ti2AlC/Cu Joints Brazed with Cu-Sn-Ti Filler Alloy

Author(s):
Publication title:
Physical and numerical simulation of materials processing VII : selected, peer reviewed papers from the 7th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS'13), June 16-19, 2013, Oulu, Finland
Title of ser.:
Materials science forum
Ser. no.:
762
Pub. Year:
2013
Page(from):
602
Page(to):
606
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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