Blank Cover Image

Evolution of Microstructure in Pure Nickel during Processing for Grain Boundary Engineering

Author(s):
Publication title:
Recrystallization and Grain Growth V : Selected, peer reviewed papers from the 5th International Conference on Recrystallization and Grain Growth (ReX&GG V), May 5-10, 2013, Sydney, Australia
Title of ser.:
Materials science forum
Ser. no.:
753
Pub. Year:
2013
Page(from):
97
Page(to):
100
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

Y. Jin, M. Bernacki, G.S. Rohrer, A.D. Rollett, B. Lin

Trans Tech Publications

S.B. Lee, A.D. Rollett, G.S. Rohrer

Trans Tech Publications

Gruber, J., George, D.C., Kuprat, A.P., Rohrer, G.S., Rollett, A.D.

Trans Tech Publications

G. Sawina, F. Gerspach, N. Bozzolo, K. Sztwiertnia, A.D. Rollett, F. Wagner

Trans Tech Publications

N. Bozzolo, G. Sawina, F. Gerspach, K. Sztwiertnia, A.D. Rollett, F. Wagner

Trans Tech Publications

L.H. Chan, G.S. Rohrer, A.D. Rollett

Trans Tech Publications

D. Kar, S.D. Sintay, G.S. Rohrer, A.D. Rollett

Trans Tech Publications

Rollett, A.D.

Trans Tech Publications

Bennett, T.A., Kim, C.S., Rohrer, G.S., Rollett, A.D.

Trans Tech Publications

D.A. Molodov, N. Bozzolo

Trans Tech Publications

P.J. Konijnenberg, S. Zaefferer, S.B. Lee, A.D. Rollett, G.S. Rohrer

Trans Tech Publications

Kinderlehrer, D., Livshits, I., Rohrer, G.S., Ta'asan, S., Yu, P.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12