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Fabrication of a SiC-Ti Functionally Graded Bonding Interlayer by Precursor Method

Author(s):
Publication title:
Advances in Functional and Electronic Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China
Title of ser.:
Materials science forum
Ser. no.:
745-746
Pub. date:
2013
Page(from):
696
Page(to):
699
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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