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Post-Growth Process Effect on Hetero-Epitaxial 3C-SiC Wafer Bow and Residual Stress

Author(s):
Publication title:
Silicon carbide and related materials 2012 : selected, peer reviewed papers from the 9th European Conference on Silicon Carbide and Related Materials (ECSCRM 2012), September 2-6,2012, St. Petersburg, Russian Federation
Title of ser.:
Materials science forum
Ser. no.:
740-742
Pub. Year:
2013
Page(from):
301
Page(to):
305
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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