Blank Cover Image

EBSD Analysis of Deformed and Partially Recrystallized Microstructures in ECAE-Processed Copper

Author(s):
Publication title:
Recrystallization and grain growth IV : selected peer reviewed papers from the Fourth International Conference on Recrystallization and Grain Growth (ReX & GG 2010), July 4-9, 2010, Sheffield, U.K.
Title of ser.:
Materials science forum
Ser. no.:
715-716
Pub. Year:
2012
Page(from):
825
Page(to):
830
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

O.V. Mishin, A. Godfrey

Trans Tech Publications

Mishin,O.V.

Trans Tech Publications

H.H. Bernardi, H.R.Z. Sandim, B. Verlinden, D. Raabe

Trans Tech Publications

Nowell, M.M., Field, D.P., Wright, S.I., Lillo, T.M.

Trans Tech Publications

N. Hansen, T.B. Yu, O.V. Mishin, X.X. Huang

Trans Tech Publications

R.A. Renzetti, M.J.R. Sandim, H.R.Z. Sandim, K.T. Hartwig, H.H. Bernardi

Trans Tech Publications

J. Kusnierz

Trans Tech Publications

Prangnell, P. B., Bowen, J. R., Gholinia, A., Markushev, M. V.

MRS-Materials Research Society

Etter, A. L., Solas, D., Baudin, T., Penelle, R.

Trans Tech Publications

Bowen, J. R., Prangnell, P. B., Humphreys, F. J.

Trans Tech Publications

C.H.J. Davies, W.Q. Cao, C.F. Gu, R.Y. Lapovok, E.V. Pereloma

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12