Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices

Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices

Author(s):

Publication title:

THERMEC 2011 : International Conference on Processing & Manufacturing of Advanced Materials : processing, fabrication, properties, applications, August 1-5, 2011, Quebec City, Canada

Title of ser.:

Materials science forum

Ser. no.:

706-709

Pub. Year:

2012

Pt.:

3

Page(from):

1979

Page(to):

1983

Pages:

5

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054200
Series ID:	PA00000012
Conf. info. (Name):	THERMEC 2011, International Conference on Processing & Manufacturing of Advanced Materials
Conf. info. (Number):	2011
Conf. info. (Venue):	Quebec City, Canada
Conf. info. (Date):	2011.08.01-2011.08.05
Note for article:	THERMEC 2011, International Conference on Processing & Manufacturing of Advanced Materials, August 1-5, 2011, Quebec City, Canada

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