Blank Cover Image

Thermal Simulation Study of 900MPa Grade High-Strength Low Alloy Steel in Welding Procedures

Author(s):
Publication title:
Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China
Title of ser.:
Materials science forum
Ser. no.:
704-705
Pub. Year:
2012
Pt.:
2
Page(from):
1128
Page(to):
1132
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

S.E. Hu, W.H. Sun, X.D. Liu, F.Q. Xiao, D.Y. Hou

Trans Tech Publications

X.L. Yang, Y.B. Xu, X.D. Tan, Y.M. Yu, D. Wu

Trans Tech Publications

X.J. Cao, P. Wanjara, A. Bernard, D. Pudo, C. Munro

Trans Tech Publications

Zhang, Mei, Ning, Yu Xiang, Zhang, Jun, Wan, Zi, Wang, Tao

Trans Tech Publications

Gu, J.L., Wei, D.Y., Chang, K.D., Liu, D.Y., Fang, H.S., Bai, B.Z., Yang, Z.G., Zhang, W.Z.

Trans Tech Publications

S.E. Hu, W.H. Sun, X.D. Liu, D.H. Hou, R. Zhou

Trans Tech Publications

Ding, H., Li, L., Xiao, Y.Z., Liu, X.H., Wang, G.D., Hu, S.E., Sun, W.H.

Trans Tech Publications

Stephen Liu, Craig Clasper, Keith Moline, Joe Scott

American Society of Mechanical Engineers

J. Lukács, L. Kuzsella, Z. Koncsik, M. Gáspár, Á. Meilinger

Trans Tech Publications

Zhao, L., Zhang, X., Chen, W., Peng, Y., Tian, Z.

SPIE - The International Society of Optical Engineering

K. Wang, J.L. Yi, S.D. Zheng, C.F. Guo, H.X. Chen

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12