Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu

Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu

Author(s):

Publication title:

Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China

Title of ser.:

Materials science forum

Ser. no.:

687

Pub. Year:

2011

Page(from):

112

Page(to):

116

Pages:

5

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054184
Series ID:	PA00000012
Conf. info. (Name):	IUMRS International Conference in Asia (IUMRS-ICA 2010)
Conf. info. (Number):	11th
Conf. info. (Venue):	Qingdao, China
Conf. info. (Date):	2010.09.25-2010.09.28
Note for article:	11th IUMRS International Conference in Asia (IUMRS-ICA 2010), 25-28 September 2010, Qingdao, China

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