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The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders

Author(s):
Publication title:
PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia
Title of ser.:
Materials science forum
Ser. no.:
654-656
Pub. Year:
2010
Pt.:
2
Page(from):
1385
Page(to):
1388
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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