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Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Author(s):
Publication title:
THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009
Title of ser.:
Materials science forum
Ser. no.:
638-642
Pub. Year:
2010
Pt.:
3
Page(from):
2841
Page(to):
2845
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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