Blank Cover Image

Dynamic Recrystallization Behavior of GH4586 Superalloy during Hot Compression

Author(s):
Publication title:
THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009
Title of ser.:
Materials science forum
Ser. no.:
638-642
Pub. Year:
2010
Pt.:
3
Page(from):
2357
Page(to):
2362
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

Wang, L., Cui, T., Lu, J., Yang, H., Zhao, G.

Trans Tech Publications

Dong-feng LI, Duan-zheng ZHANG, Sheng-dan LIU, Zhao-jun SHAN, Xin-ming ZHANG, Qin WANG, Su-qi HAN

Editorial Office of Trans. NFsoc., Central-South University of Technology

S.L. Yu, Y.H. Gao, C.M. Liu, H.C. Xiao

Trans Tech Publications

J. Shen, J.P. Li, L.M. Yan, X.D. Yan

Trans Tech Publications

Y. Wang, W.Z. Shao, L. Zhen, L. Lin, Y.X. Cui

Trans Tech Publications

C.L. Gan, K.H. Zheng, H.Y. Wang, W.J. Qi, N. Zhou

Trans Tech Publications

Y.P. Li, S. Kurosu, E. Onodera, H. Matsumoto, A. Chiba

Trans Tech Publications

L. Wang, F. Liu

Trans Tech Publications

G.J. Huang, Q. Liu, L.Y. Wang, X.H. Yin

Trans Tech Publications

Wang, X., Gordaninejad, F., Hitchcock, G.H.

SPIE - The International Society of Optical Engineering

L.R. Liu, J.S. Huang, G.Q. Zu

Trans Tech Publications

Backx, P., Kestens, L.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12